| 摘要 |
PROBLEM TO BE SOLVED: To improve the reliability and yielding ratio of products by suppressing the occurrence of abnormal machining due to loading and releasing of abrasive grains to a minimum. SOLUTION: A ground wafer 1 is cleaned and dried by holding it on the spinner table 81 of a cleaning unit 75. After that, the machined surface is photographed by a camera 96 in this state. The photographed image is treated by an image processing means 101 and is supplied to a control means 102. The control means 102 judges whether or not the image processing data is deviated from a required range of reference image data. When the deviation exists, it is considered to be caused by abnormal machining, and a procedure, such as a stop of operation, is performed. COPYRIGHT: (C)2008,JPO&INPIT
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