| 摘要 |
A insulating resin cured film provided after the formation of tin plating, substantially containing no copper, on a flexible printed wiring board for electronic component, wherein the glass transition temperature of the film after being cured is 80° C. or less, and a process for producing the same. There is provided a flexible printed wiring board with tin plating substantially containing no copper for an electronic component, having coated thereon a resin cured film of photocurable and thermosetting resin, in which fewer copper is diffused in a pure tin plating layer, in comparison with that provided by a prior method.
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