| 发明名称 |
POSITIVE PHOTOSENSITIVE RESIN COMPOSITION |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition excellent in chemical resistance and resolution after curing. <P>SOLUTION: The positive photosensitive resin composition comprises (a) an alkali-soluble resin and (b) a quinonediazide compound having an alkoxymethyl group. <P>COPYRIGHT: (C)2008,JPO&INPIT |
| 申请公布号 |
JP2008158263(A) |
申请公布日期 |
2008.07.10 |
| 申请号 |
JP20060347113 |
申请日期 |
2006.12.25 |
| 申请人 |
TORAY IND INC |
发明人 |
MIYOSHI KAZUTO;TOMIKAWA MASAO |
| 分类号 |
G03F7/022;G03F7/023;G03F7/40;H01L21/027 |
主分类号 |
G03F7/022 |
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