| 摘要 |
<P>PROBLEM TO BE SOLVED: To perform reflow soldering with high reliability by touching a bump surely to the pad electrode of a substrate in a flip-chip interconnection method by no-flow underfill. <P>SOLUTION: In the flip-chip interconnection method by no-flow underfill where resin 54 is applied previously to a substrate 52 and then a semiconductor 50 with bumps is mounted on the substrate 52 in order to bond the pad electrode 53 of the substrate 52 and the bump 51, the substrate 52 is mounted on the upper surface of the base mount 11 of a reflow tool 10, resin 54 highly filled with filler 55 is applied to the substrate 52, the semiconductor 50 with bumps is mounted at a predetermined position on the substrate 52, a retaining plate 21 larger than the outer dimensions of the substrate 52 is mounted above the semiconductor 50, the amount of pushing of the retaining plate 21 is regulated by interposing a spacer 13 between the lower surface of the retaining plate 21 and the upper surface of the base mount 11, and the amount of horizontal movement of the retaining plate 21 is regulated by means of a positioning guide pin 15 plated on the upper surface of the base mount 11. <P>COPYRIGHT: (C)2008,JPO&INPIT |
