| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a structure capable of diffusing heat emitted from an optical function element and both of heat stored in an inner cavity which is regulated by a substrate and a window lid covering an element mounting surface of the substrate and the heat of the window lid itself to the outside of a semiconductor package. <P>SOLUTION: The substrate 2 has a combination of a first heat radiation route 11 for diffusing light emitted from the optical function element 1 from the back of the substrate and a second heat radiation route 21 for diffusing heat generated in the inner cavity and heat from the window lid itself from the back and/or side face of the substrate and is configured so that these heat radiation routes 11, 21 have thermal vias penetrated into the substrate and filled with a heat conductive material. <P>COPYRIGHT: (C)2008,JPO&INPIT |
