发明名称 SUBSTRATE FOR LIGHT EMITTING ELEMENT AGGREGATION, AND SUBSTRATE WITH LIGHT EMITTING DEVICE AGGREGATION
摘要 <P>PROBLEM TO BE SOLVED: To provide a substrate for light emitting element aggregation, which is excellent in heat radiation and is easily divided, and to provide light emitting device aggregation. <P>SOLUTION: In a substrate 1 for connecting a light emitting element on which a plurality of wiring substrates 3 for a light emitting element are arranged lengthwise and crosswise interposing dividing areas between them, the substrate 3 for a light emitting element includes a plane-sheet-like metal substrate 5 composed of sintered metal, a mounting portion 7 for mounting the light emitting element 37 formed on the upper surface of the metal substrate 5, a through insulating body 9 composed of a ceramics passing through the metal substrate 5 in a direction of the thickness, a through conductor 11 which is electrically insulated from the metal substrate 5 and passes through the inside of the through insulating body 9 in a direction of the thickness, and wiring 13 which is electrically connected with the through conductor 11, is insulated from the metal substrate 5, and is located around the circumference the mounting portion 7. A groove is formed on the surface of the dividing area, and cavities 19 are located along the whole circumference of substrate area of the wiring substrate for a light emitting element in the dividing area 4 at intervals. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008159937(A) 申请公布日期 2008.07.10
申请号 JP20060348411 申请日期 2006.12.25
申请人 KYOCERA CORP 发明人 IZUMI MINAKO;HASEGAWA TOMOHIDE;SASAKI YASUHIRO
分类号 H01L33/50;H01L33/56;H01L33/62;H01L33/64 主分类号 H01L33/50
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