MOUNTING STRUCTURE OF SEMICONDUCTOR ELEMENT

摘要

PROBLEM TO BE SOLVED: To provide a mounting structure of a semiconductor element, which suppresses the heat deformation of a wiring board and is excellent in heat resistance by radiating heat transmitted to the wiring board.

SOLUTION: The mounting structure of the semiconductor element comprises: the wiring board 1 provided with a plurality of first fibers 8a disposed along a first direction X in the plane view and a plurality of second fibers 8b disposed along a second direction Y different from the first direction X; and a rectangular semiconductor element 2 to be mounted on the wiring board 1 on the wiring board 1. The semiconductor element 2 is disposed so that a straight line L along its one side crosses both of a straight line Lx along the first direction X and a straight line Ly along the second direction Y in the plane view.

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