发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of obtaining symmetry of processings for a substrate to be processed, in the inner tank in the width direction and the depth direction of the inner tank, by symmetrically releasing bubbles generated from the bottom surface of the inner tank, with respect to the center line in the width direction and depth direction of the inner tank. SOLUTION: The substrate processing apparatus comprises an outer tank 10 for storing liquid, an ultrasonic wave generator 15 for irradiating the liquid in the outer tank 10 with ultrasonic waves, an inner tank 20 disposed in the inside of the outer tank 10, and a pure water supply source 30 for supplying the liquid to the outer tank 10. The bottom surface of the inner tank 20 is symmetric with to the center line of the inner tank 20, in both the directions of the width and the depth. The pure water supply source 30 supplies liquid to the inside of the outer tank 10 so that the flow of the liquid is symmetric with respect to the center line of the inner tank 20 in both the directions of the width and the depth, inside the outer tank 10. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008160012(A) 申请公布日期 2008.07.10
申请号 JP20060349664 申请日期 2006.12.26
申请人 TOKYO ELECTRON LTD 发明人 SHIOKAWA TOSHIYUKI;EJIMA KAZUYOSHI
分类号 H01L21/306;H01L21/304 主分类号 H01L21/306
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