| 摘要 |
PROBLEM TO BE SOLVED: To miniaturize a high-impedance substrate. SOLUTION: The high-impedance substrate as one mode of this invention is provided with a finite ground plane, a plurality of metal plates arranged at a predetermined height from the finite ground plane and in a matrix pattern such that respective faces thereof are approximately parallel to the finite ground plane, and a plurality of linear conductive elements for connecting the finite ground plane and the plurality of metal plates. The metal plates arranged at an outermost periphery among the plurality of metal plates arranged in the matrix pattern are connected with the linear conductive elements at the outer periphery of the metal plates. COPYRIGHT: (C)2008,JPO&INPIT
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