| 摘要 |
PROBLEM TO BE SOLVED: To provide a high adhesion copolymerized polyimide film having improved adhesiveness to a copper foil and excellent slipperiness, dimensional stability and water wettability. SOLUTION: The high adhesion polyimide film having a 200°C heat-shrinkage of≤0.05% in both machine transportation direction (MD) and transverse direction (TD), a film surface roughness Ra of≥0.065μm and Rmax of≥1.0μm measured by a stylus-type surface roughness tester and a surface free energy of≥80 mN/m measured by a contact angle method is produced from a polyimide film derived from 3,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl ether and pyromellitic dianhydride by successively applying a sand-matting treatment, a relaxation treatment and a plasma treatment to the polyimide film. COPYRIGHT: (C)2008,JPO&INPIT
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