| 摘要 |
The present invention relates to a stackable semiconductor package and the method for making the same. The stackable semiconductor package comprises a first substrate, a semiconductor device, a plurality of stud bumps, a plurality of first wires, a second substrate, and a molding compound. The semiconductor device is disposed on the first substrate and electrically connected to the first substrate. The stud bumps are above the semiconductor device. The first wires are used for electrically connecting the stud bumps and the first substrate. The stud bumps are in contact with the second substrate. The molding compound encapsulates the first substrate, the semiconductor device, the stud bumps, the first wires, and the second substrate, and thus, the second substrate will not undergo wire bonding, and will not be suspended and shake or sway, as present in a conventional stackable semiconductor package.
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