| 摘要 |
A method and system for cleaning a substrate is provided. More particularly systems and methods that allows for precise tailoring of megasonics distribution at a substrate surface to be above the threshold required for particle removal efficiency (PRE), yet below the value which causes structural damage are provided. This method utilizes multiple megasonics transducers operated at very low power densities in a single substrate immersion processor. This method is shown to produce high cleaning efficiencies without damage to 45 nm devices. Further, sonoluminescence studies demonstrate that the transducers are operated in the single bubble sonoluminescence (SBSL) regime, well below the cavitation threshold for transient multiple-bubble sonoluminescence (MBSL).
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