Electronic component built-in substrate and method for manufacturing the same

摘要

It is an electronic component built-in substrate 100 configured as follows. That is, an electronic component 30 is provided between at least two boards 10 and 20 . An electrode 34 of the electronic component 30 is electrically connected to at least one of the board 10 . Also, the boards 10 and 20 are electrically connected to each other. Additionally, the gap between the boards 10 and 20 is sealed with a resin. The electronic component built-in substrate 100 is featured in that a solder ball 40 for electrically connecting the boards 10 and 20 to each other is provided on a surface of the electronic component 30 , which faces the other board 20.