发明名称 RESIN COMPOSITION FOR LIGHT-EMITTING DEVICE SEALING AND LAMP
摘要 <p>Disclosed is a resin composition for light-emitting device sealing, which contains a silsesquioxane resin containing two or more oxetanyl groups, an aliphatic hydrocarbon containing one or more epoxy groups, and a cationic polymerization initiator. Also disclosed is a lamp comprising a package having a cup-shaped sealing portion, an electrode exposed at the bottom of the sealing portion, and a light-emitting device arranged on the bottom of the sealing portion and electrically connected with the electrode. The light-emitting device is sealed with the resin composition for light-emitting device sealing which is filled into the sealing portion.</p>
申请公布号 WO2008081900(A1) 申请公布日期 2008.07.10
申请号 WO2007JP75196 申请日期 2007.12.27
申请人 SHOWA DENKO K.K.;TAKEI, TOMOYUKI;SAKATA, YUKO 发明人 TAKEI, TOMOYUKI;SAKATA, YUKO
分类号 C08G59/68;C08G65/22;H01L33/56 主分类号 C08G59/68
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