发明名称 |
RESIN COMPOSITION FOR LIGHT-EMITTING DEVICE SEALING AND LAMP |
摘要 |
<p>Disclosed is a resin composition for light-emitting device sealing, which contains a silsesquioxane resin containing two or more oxetanyl groups, an aliphatic hydrocarbon containing one or more epoxy groups, and a cationic polymerization initiator. Also disclosed is a lamp comprising a package having a cup-shaped sealing portion, an electrode exposed at the bottom of the sealing portion, and a light-emitting device arranged on the bottom of the sealing portion and electrically connected with the electrode. The light-emitting device is sealed with the resin composition for light-emitting device sealing which is filled into the sealing portion.</p> |
申请公布号 |
WO2008081900(A1) |
申请公布日期 |
2008.07.10 |
申请号 |
WO2007JP75196 |
申请日期 |
2007.12.27 |
申请人 |
SHOWA DENKO K.K.;TAKEI, TOMOYUKI;SAKATA, YUKO |
发明人 |
TAKEI, TOMOYUKI;SAKATA, YUKO |
分类号 |
C08G59/68;C08G65/22;H01L33/56 |
主分类号 |
C08G59/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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