| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device including a columnar electrode having one end connected to a wiring layer disposed on a semiconductor element and the other end with an external connection member, as well as its manufacture, in which occurrence of short circuit between adjacent external connection members can be suppressed. SOLUTION: The semiconductor device includes the semiconductor element 22, the wiring layer 21 disposed on the semiconductor element 22, the columnar electrode 25A connected at one end to the wiring layer 21 (electrode pad 38) and a sealing resin 28 formed on the semiconductor element 22. The columnar electrode 25A is formed to project from the sealing resin 28 and a solder ball 27 is disposed at the other end (top end 36A) of the columnar electrode 25A projecting from the sealing resin 28 so as to be separated from the surface of the sealing resin 28. COPYRIGHT: (C)2008,JPO&INPIT |
