发明名称 Input/output pads placement for a smart card chip
摘要 A chip for a smart card including a plurality of electrical contacts for communication of data with a smart card reader is disclosed. In one embodiment, a chip for a smart card includes a core circuit and a plurality of input/output pads corresponding to said set of electrical contacts, wherein said input/output pads are divided into at least a first column and a second column placed immediately adjacent to the first column, such that the first and second columns form a cluster. In another embodiment, eight input/output pads are divided into two columns, placed immediately adjacent to each other. The cluster may be partially surrounded by the core circuit. The chip may further comprise an ESD network, comprising VDD and GND buses for improved ESD protection while reducing the size of the chip.
申请公布号 US2008164324(A1) 申请公布日期 2008.07.10
申请号 US20070651870 申请日期 2007.01.10
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 SONG MING-HSIANG
分类号 G06K19/06 主分类号 G06K19/06
代理机构 代理人
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