| 摘要 |
An apparatus and a method for packaging semiconductor devices. The apparatus is a three- dimensional electronic package comprising one or more electronic components (305, 307, 355, 357), a plurality of electrical contact pads (333, 335), and a plurality of electrically conductive three-dimensional plugs (315) formed through an encapsulant (311, 361). Specific ones of the plurality of electrical contact pads (333, 335) are electrically coupled to the one or more electronic components (305, 307, 355, 357) on an uppermost surface of the plurality of electrical contact pads (333, 335). The encapsulant (311, 361) is formed over and covers the one or more electronic devices (305, 307, 355, 357). The plurality of three-dimensional plugs (315) have a first end extending from at least the uppermost portion of one or more of the plurality of electrical contact pads (333, 335) and a second end extending substantially to an uppermost surface of the encapsulant (311, 361). |
