Semiconductor module, has semiconductor chip provided with contact area, and dielectric layer applied on semiconductor chip, where dielectric layer includes fluorine-carbon compound e.g. fluorinated hydrocarbon compound

摘要

The module (100) has a semiconductor chip (1) provided with a contact area (2). A dielectric layer (3) is applied on the semiconductor chip, where the dielectric layer includes a fluorine-carbon compound e.g. fluorinated hydrocarbon compound and polymer such as polytetrafluoroethylene. A wiring layer (4) is applied on the semiconductor chip and on the dielectric layer, where the wiring layer is electrically connected with the contact area. Another dielectric layer is applied on the wiring layer, where the layer contains the fluorine-carbon compound. An independent claim is also included for a method for producing a semiconductor module.