| 摘要 |
<P>PROBLEM TO BE SOLVED: To increase the area of an electrode formation region and mounting region while maintaining strength of a dam member, relating to a mounting board and an electronic apparatus comprising the dam for suppressing flow of an underfill material. <P>SOLUTION: The mounting board comprises on a board body 14a a chip mounting region 27 for mounting an electronic element, an electrode formation region 28 that is formed by enclosing the chip mounting region 27 with an upper electrode 18 being formed therein, and a dam member 50 that is formed at the border part between the chip mounting region 27 and the electrode formation region 28 to prevent an underfill resin 23 from leaking into the electrode formation region 28. A recess 51 is formed at such position as faces the upper electrode 18 of the dam member 50, and a part of the upper electrode 18 is positioned inside the recess 51. <P>COPYRIGHT: (C)2008,JPO&INPIT |
