| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for reducing the length of wire by preventing an Ag paste film from sticking out to the surrounding area of a semiconductor bare chip as much as possible. <P>SOLUTION: Several grooves 110-1 to 110-8 are formed in a radial pattern on the surface of a die pad 103. The grooves are a series of triangles which are broadened toward the end when they are viewed from the center of the die pad 103 toward its periphery and their ends are positioned on the inner side of the periphery of the die pad 103. When the semiconductor bare chip 20 is put on it and the Ag paste is pushed and spread, the Ag paste is smoothly spread in the grooves up to their ends. In this way, even if the supply amount of the Ag paste is smaller than before, the film of Ag paste is formed on the whole surface of the underside of the semiconductor bare chip 20. The Ag paste film is prevented form sticking out to the surrounding area of the semiconductor bare chip 20 and a terminal pad 104 can be arranged in a position closer to the die pad 103 than in a conventional case. The length of the wire 130 is reduced compared to the conventional case. <P>COPYRIGHT: (C)2008,JPO&INPIT |
