| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for mounting a chip part and a chip part support in which void in a solder is reduced. SOLUTION: The method for mounting the chip part contains: a first step of preparing a support substrate 2 on an upper face of which a conductor film for mounting the chip part 3 having guide areas 3b led respectively from both ends of one side of a fixing area 3a is formed: a second step of arranging a solder 4 on an upper face of the conductor film for mounting the chip part 3; a third step of arranging a chip part 1 on the support substrate 2 so that both ends on one side of a lower face are mounted in the guide area 3b of the conductor film for mounting the chip part 3 via the solder 4; and a fourth step of heating and melting the solder 4 so that the chip part 1 is moved from the guide area 3b of the conductor film for mounting the chip part 3 to the fixing area 3a thereof by the melted solder 4. As a component to be vaporized is sufficiently released from inside of the solder 4 in a process of melting and solidifying the solder 4, it is possible to accomplish the method for mounting the chip part in which void in the solder 4 is reduced after a solidification. COPYRIGHT: (C)2008,JPO&INPIT |
