发明名称 PROCESS FOR HIGH VOLTAGE SUPERJUNCTION TERMINATION
摘要 A method of manufacturing a semiconductor device having an active region and a termination region includes providing a semiconductor substrate having first and second main surfaces opposite to each other. The semiconductor substrate has an active region and a termination region surrounding the active region. The first main surface is oxidized. A first plurality of trenches and a first plurality of mesas are formed in the termination region. The first plurality of trenches in the termination region are filled with a dielectric material. A second plurality of trenches in the termination region. The second plurality of trenches are with the dielectric material.
申请公布号 US2008166855(A1) 申请公布日期 2008.07.10
申请号 US20080053062 申请日期 2008.03.21
申请人 THIRD DIMENSION (3D) SEMICONDUCTOR, INC. 发明人 HSHIEH FWU-IUAN;PRATT BRIAN D.
分类号 H01L21/762 主分类号 H01L21/762
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