| 摘要 |
1,166,603. Encapsulated semi-conductor devices. MOTOROLA Inc. 23 Sept., 1966 [24 Oct., 1965], No. 42663/66. Heading B5A. [Also in Division H1] A metallic member 12 comprising portions 16 supporting thereon a plurality of semi-conductor elements 14 and a tie-strip 22 inter-connecting them is encapsulated in plastics material using a multicavity mould (Fig. 2, not shown), each group 20 to one cavity, the mould parts (30, 31, Figs. 3, 4, not shown) closing on the tie strip 22 at face (37) to seal the cavity and also on extension 41 of the tie strip 22 in recess (44) to deform extension 41 (Fig. 6, not shown), e.g. by means of a projection (46) on the upper mould part (30) to seal the cavity at this point, the deformed extension 41 subsequently being removed from the encapsulated article. |
