| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a power conversion apparatus to avoid thermal constraints of a device and enhance the mounting density. <P>SOLUTION: A main pipe on a water supply side, where cooling water flows, and a main pipe on a water discharge side are constituted of a cooling plate 6 on a water supply side having a space inside to let the cooling water flow, and a cooling plate 7 on a water discharge side. These water-supply side cooling plate 6 and the water-discharge side cooling plate 7 are connected to individual units 1 comprising a semiconductor switching element, a capacitor, a resistor, a reactor, a fuse and a substrate by a water-supply side branch piping and a water-discharge side branch piping respectively. Thus, the water supply side pipe and the water-discharge side pipe can be respectively constituted of the water-supply side cooling plate comprising the plate-like body, having a space inside to let the cooling water flow and the water-discharge side cooling plate to enlarge the inside article arrangement space, and thermal constraints on the device are avoided and the mounting density is improved. <P>COPYRIGHT: (C)2008,JPO&INPIT |
