| 摘要 |
PROBLEM TO BE SOLVED: To provide a package structure capable of improving reliability of a semiconductor package product. SOLUTION: Provided are a plurality of first side leads 211 and a plurality of second side leads 212 of a lead frame. A plurality of first die attach strips 220 are stuck on undersurfaces of some of the group of the first-side leads 211. A first chip 230 has an active surface stuck on the group of the first die attach strips 220. A plurality of first bonding wires 251 electrically connect a single-side pad 232 to the group of the first-side leads 211 and the group of the second-side leads 212. A second chip 240 is disposed above the group of the first-side leads 211. A plurality of second bonding wires 252 electrically connect the side of the first-side leads 211 and the group of the second-side leads 212 to the second chip 240. A sealing body 260 is charged in a flow type path 221. COPYRIGHT: (C)2008,JPO&INPIT
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