EPOXY RESIN COMPOSITION FOR ENCAPSULATING ELECTRONIC COMPONENT AND RESIN-ENCAPSULATED ELECTRONIC COMPONENT USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin composition for encapsulating electronic components which is improved in both shape retention and workability. SOLUTION: The epoxy resin composition for encapsulating electronic components contains an epoxy resin, a solid particulate curing agent having a mean particle size of ≤10 μm, an inorganic filler and an amide-based wax as the essential components, and it is liquid at ordinary temperature. The amide-based wax is incorporated in the range of 3-15 mass% to the epoxy resin. COPYRIGHT: (C)2008,JPO&INPIT