发明名称 High-load even pressure heatsink loading for low-profile blade computer applications
摘要 An apparatus for dissipating heat in a computer system includes a heat sink, at least one fastener which secures the heat sink to at least one first support member, and at least one cup. The first support member has a top side and a bottom side. The at least one cup includes a cylindrical cavity, an upper protruding lip, and a lower base having a hole through which the at least one fastener passes. A method for dissipating heat in a computer system includes, mounting a heat emitting component onto a printed circuit board, pressing a heat sink into thermal contact with a heat emitting component, inserting a cup into an aperture of the heat sink, and supporting a heat sink.
申请公布号 US2008165501(A1) 申请公布日期 2008.07.10
申请号 US20070651762 申请日期 2007.01.10
申请人 SUN MICROSYSTEMS, INC. 发明人 STEWART THOMAS E.;HRUSKA DANIEL
分类号 H05K7/20 主分类号 H05K7/20
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