| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multichip module which can be reduced in warping and its manufacturing method, and to provide a mounting structure of the multichip module and its manufacturing method. <P>SOLUTION: With a center plane 4A in the cross-sectional direction of the multichip module 20 as a reference, the same kind of constitutional materials are disposed nearly plane-symmetrically. An upper structure and a lower structure located across the center plane 4A in the cross-sectional direction of the multichip module 20 both include a base material and electronic components as the constitutional materials. <P>COPYRIGHT: (C)2008,JPO&INPIT |
