| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate incorporating a plurality of stacked electronic components in which plane dimensions can be reduced sharply and the manufacturing cost can be reduced. <P>SOLUTION: In the substrate 100 incorporating electronic components 30 and 60 stacked in a plurality of stages between a pair of wiring substrates 10 and 20, one wiring substrate 10 and other wiring substrate 20 are connected electrically through solder balls 40; a first electronic component 30 is mounted on one wiring substrate 10; a second electronic component 60 is mounted on the first electronic component 30; the other wiring substrate 20 is provided with an opening 24 for containing the second electronic component 60; the second electronic component 60 is mounted in the opening 24 and connected electrically with the other wiring substrate 20 by wire bonding, and the gap between the pair of wiring substrates 10 and 20 is filled with sealing resin 50. <P>COPYRIGHT: (C)2008,JPO&INPIT |
