| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for multiple housing of electronic components which allows efficiently and properly confirming an air-tightness of recesses for package regions for housing electronic components; a method of measuring a package for multiple housing of electronic components; a package for housing electronic components and a method of measuring a package for housing electronic components which allow properly confirming an air-tightness of recesses; and a highly reliable electronic device. SOLUTION: The package for multiple housing of electronic components has: a mother board 1; a plurality of recesses 5 and a plurality of package regions for housing electronic components 6 corresponding to the plurality of recess 5 defined by a latticework structure 2 arranged on one of major surfaces of the mother board 1; and furthermore, a pair of electrodes for measurement 3 which is embedded between the mother board 1 and the latticework structure 2 of the package regions for housing electronic components 6 and is arranged spaced apart from each other. COPYRIGHT: (C)2008,JPO&INPIT |
