| 摘要 |
PROBLEM TO BE SOLVED: To provide an analysis apparatus and method of wafer contaminants which can detect and analyze the contaminants immediately in the state of a wafer using a laser. SOLUTION: The analysis apparatus 100 of wafer contaminants comprises a wafer holder 160 to support a wafer W for which contaminants are to be analyzed, a laser abrasion device 110 to irradiate laser L on the wafer W side to gather a sample separated from the wafer W, an analysis cell 170 to gather the sample separated from the wafer W surface by irradiating the laser L, and an analysis device 190 to analyze contaminants from the sample gathered above by connecting to the analysis cell 170. COPYRIGHT: (C)2008,JPO&INPIT
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