METHOD FOR PACKAGING ELECTRONIC COMPONENT, METHOD FOR PRODUCING SUBSTRATE INCORPORATING ELECTRONIC COMPONENT, AND SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a method for securing an electronic component while suppressing warpage or bending when the electronic component and a resin layer are bonded to each other.

SOLUTION: When a substrate 200 with a built-in semiconductor device 220 is produced, the semiconductor device 220 is mounted on an uncured resin layer 212 and then contained in the container 31 of a hot press 3. Then, the semiconductor device 220 is press-bonded to the uncured resin layer 212 while heating and stiffening the resin layer 212 by pressing the semiconductor device 220 isotropically using the gas in the container 31 as a pressure medium. The semiconductor device 220 is secured to the resin layer 212 and packaged without causing warpage or bending thereby.

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