PACKAGING STRUCTURE OF PCB AND ELEMENT MODULE AND PACKAGING METHOD OF THE SAME

摘要

A packaging structure of PCB and element module, comprising PCB (2) and the element module (1); a through-hole (II) is formed in the center area of PCB (2), PCB (2) includes a first packaging surface (21) and a second packaging surface (22), the second soldering points (24) disposed on the edges of through-hole (II) of the first carrier surface and the first soldering points (23) disposed separately with the second soldering point at a certain distance; the element module (1) includes a first packaging surface (11) and a second packaging surface (12), the first packaging end points (14) disposed on the sides of the first packaging surface (11) and the second packaging end points (13) disposed separately with the first packaging end points (14) at a certain distance, the inner area surrounded by the second packaging end points (13) is an element module area (19); the element module area (19) of the first packaging surface of the element module (1) lies in the through-hole (II) of PCB, so that the first and second packaging end points of the element module are electrically contacted and soldered with the first and second soldering points of PCB respectively.