| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring structure or the like capable of surely connecting a body to be wired and a wiring layer while maintaining an insulation between the wiring layer and an adjacent wiring layer and capable of achieving a high-density mounting by narrowing pitches. <P>SOLUTION: In a semiconductor built-in board 1, conductor patterns 13 are formed on both surfaces of a core board 11, and a semiconductor device 14 is arranged in a resin layer 16 laminated on the core board 11. Via holes 19a and 19b are formed to the resin layer 16 so that the conductor patterns 13 and bumps 14p for the semiconductor device 14 are projected from the resin layer 16. The bumps 14p and the conductor patterns 13 are connected to via-hole electrode sections 23a and 23b having sectional areas increasing towards the bottom sections of the via holes 19a and 19b in the via holes 19a and 19b. Air gaps are defined between the via-hole electrode sections 23a and 23b and the upper sections of the inner walls of the via holes 19a and 19b. <P>COPYRIGHT: (C)2008,JPO&INPIT |
