发明名称 PHOTOELECTRIC WIRING BOARD AND METHOD OF MANUFACTURING PHOTOELECTRIC WIRING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a photoelectric wiring board on which an optical semiconductor element is mounted with high positioning accuracy and to provide a method of manufacturing a photoelectric wiring apparatus using the photoelectric wiring board. <P>SOLUTION: For mounting an optical semiconductor element with high positioning accuracy on the photoelectric wiring board 110 on which optical wiring 20 is provided, monitor optical wiring is simultaneously provided when the optical wiring 20 is provided on the photoelectric wiring board, and the optical semiconductor element is mounted with high positioning accuracy by confirming the relative optical axis position of the optical wiring by recognizing the light output from the monitor optical wiring. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008158440(A) 申请公布日期 2008.07.10
申请号 JP20060350007 申请日期 2006.12.26
申请人 TOSHIBA CORP 发明人 FURUYAMA HIDETO
分类号 G02B6/122;G02B6/42;H01L31/0232;H01S5/022;H05K1/02 主分类号 G02B6/122
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