发明名称 HEAT-CONDUCTING MATERIAL
摘要 <P>PROBLEM TO BE SOLVED: To provide a highly safe heat-conducting material having not only good heat conductivity, but also excellent compressibility and adhesiveness to a base material, and hardly causing liquid leakage. <P>SOLUTION: The heat-conducting material has a structure obtained by binding (A) a polymer gel member with (B) a heat-radiating member, wherein the polymer gel member contains (E) a thermoconductive medium in a three-dimensional network formed by compounding (C) a water-swellable clay mineral with (D) a polymer of a (meth)acrylamide-based compound. The heat-conducting material having mechanical toughness and hardly causing liquid leakage is obtained by sticking the polymer gel having the three-dimensional network comprising the polymer of the acrylamide-based compound and the water-swellable clay mineral to a heat-radiating member to laminate them. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008156406(A) 申请公布日期 2008.07.10
申请号 JP20060344162 申请日期 2006.12.21
申请人 KAWAMURA INST OF CHEM RES 发明人 HARAGUCHI KAZUTOSHI
分类号 C09K5/08;C08K3/34;C08K5/00;C08L33/26;H01L23/36 主分类号 C09K5/08
代理机构 代理人
主权项
地址
您可能感兴趣的专利