| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive film composition and an adhesive film which have excellent solid-phase properties at ordinary temperatures, decrease the adhesion to a PSA layer, facilitate the pickup at the time of a die picking-up process, and furthermore giving flowability at a specific bonding-temperature at the time of a die attaching process and maintaining the high reliability on a packaged element by suppressing occurrence of the air bubble from an interface between the adhesive film and either the PCB or a wafer substrate. <P>SOLUTION: The adhesive film composition and the adhesive film containing this, comprise a polyester-based thermoplastic resin; an elastomer resin containing at least one kind group selected from the group consisting of a hydroxy group, a carboxy group and an epoxy group; an epoxy resin; a phenol hardener; at least one kind material selected from the group consisting of a latent catalyst-type hardener and a curing catalyst; a silane coupling agent; and a filler. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
