| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer board having higher reliability. <P>SOLUTION: The multilayer board 100 has an insulating layer 111 formed of a thermoplastic material, and a conductive layer 112 with a conductive material patterned in a predetermined circuit pattern. These layers 111 and 112 are alternately laminated with each other. Further, the board 100 has an interlayer connector 114 for electrically connecting adjoining patterns through the insulating layer 111. In the left and right parts of the multilayer board 100, many layers are left with the conductive material as the circuit pattern. On the other hand, in the center of the board 100 less of the layers are left. A recess 142 is formed in the center of the board 100 having such less layers. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
