| 摘要 |
PROBLEM TO BE SOLVED: To inexpensively and efficiently prevent uneven film thickness of a resist by forming an appropriate modified layer on the surface of the resist immediately after applied on a substrate to be treated without using a reduced pressure drying means. SOLUTION: In a resist surface treating unit (VD) 46, a substrate G immediately after coated with a resist is conveyed by a flat flow system over a roller conveyance passage 104, sprayed with a dry gas (A) by a drying gas blowing section 106 in the middle of the passage, and further sprayed with chemical component-containing air B<SB>1</SB>, B<SB>2</SB>by first and second chemical liquid component-containing gas blowing sections 108, 109, respectively. A substance that reacts with the resist to produce a modified layer is used for the chemical liquid component, and preferably, a vapor of a developing solution or HMDS (hexamethyldisilazane) is used. Air is preferably used for the gas. COPYRIGHT: (C)2008,JPO&INPIT |
