| 摘要 |
PROBLEM TO BE SOLVED: To conduct accurate inspection by eliminating contact failure between a pad of semiconductor device and a probe. SOLUTION: In the probing inspection under the wafer condition of a semiconductor device including a plurality of power-supply pads 6, 7 of the equal potential and a grounding pad 8 that are connected mutually within the semiconductor device, probes in poor contact with the power-supply pads 6, 7 can completely be detected and can also be cleaned by providing dummy pads including only one uncovered pad to the semiconductor device in such a manner as if at least an uncovered pad were provided for all power supply pads and by conducting contact check for all dummy pads before probing inspection in the wafer condition. Therefore, contact failure on all pads of the semiconductor device and the probe can be eliminated and accurate inspection can be realized. COPYRIGHT: (C)2008,JPO&INPIT
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