| 摘要 |
A stencil printer for depositing solder paste onto a plurality of pads of an electronic substrate includes a frame and a stencil coupled to the frame. The stencil has a plurality of apertures formed therein. The stencil printer further includes a support assembly coupled to the frame, the support assembly supporting the electronic substrate in a printing position. An imaging system is adapted to capture images of multiple areas of one of the electronic substrate and the stencil. A controller, coupled to the imaging system, is adapted to control movement of the imaging system to capture an image of an area while maintaining a minimum velocity above zero when capturing the image of the area. Methods for dispensing solder paste on a substrate and for inspecting the substrate are further disclosed. |
