| 摘要 |
<p>A composition for forming a photosensitive polymer composite, a method for preparing a photosensitive polymer composite by using the composition, and an electronic part device containing the polymer composite are provided to improve heat resistance and abrasion resistance. A composition for forming a photosensitive polymer composite comprises 30-90 wt% of a multifunctional epoxy resin; 0.1-10 wt% of a photoacid generator; 1-70 wt% of an organic solvent; and 0.1-20 wt% of a silver compound. Preferably the silver compound is at least one selected from the group consisting of silver acetate, silver tetrafluoroborate, silver thiocyanate, silver trifluoromethanesulfonate, silver sulfate, silver phosphate, silver trifluoroacetate, sliver oxide(I), silver oxide(II), silver iodide, silver chloride, silver carbonate, silver hexafluorophosphate, silver nitride, silver fluoride, sliver bromide and silver hexafluoroantimonate.</p> |
