SEMICONDUCTOR PACKAGING BODIES HAVING CONNECTION MEAN BETWEEN CIRCUIT SUBSTRATE AND DEVICE PACKAGE

摘要

Semiconductor packaging bodies having connection units between a circuit substrate and a device package are provided to couple tightly the circuit substrate with the device package by utilizing the connection units having a screw coupling structure. Semiconductor packaging bodies include a circuit substrate(60), a device package(20), and connection units(18). The circuit substrate includes at least one or more board line patterns(44). The device package, which is disposed under the circuit substrate, includes device line patterns(14) corresponding to the board line patterns. The connection units are protruded from the device line patterns of the device package and passed over the board line patterns to surround the circuit substrate. The connection units are screw-coupled with at least one of the board and device line patterns.