| 摘要 |
A system for cooling a wafer chuck of semiconductor test equipment is provided to adjust rapidly the temperature of the wafer chuck in a sub-cooling tank by utilizing coolant supplied from a main cooling tank. A system for cooling a wafer chuck of semiconductor test equipment includes an evaporator(10), a main cooling tank(11), a sub-cooling tank(12), and a wafer chuck(13). The evaporator converts liquid coolant with low temperature and pressure into gas coolant with high temperature and pressure. The main cooling tank, which is installed at a side of the evaporator, stores coolant and maintains constantly temperature therein. The sub-cooling tank, which is installed at a side of the main cooling tank, receives coolant from the main cooling tank. The wafer chuck is connected to the sub-cooling tank through a sub-loop line.
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