| 发明名称 |
PROCEDE POUR EMBALLER DES PASTILLES SEMI-CONDUCTRICES ET STRUCTURE DE PASTILLE SEMI-CONDUCTRICE AINSI OBTENUE |
| 摘要 |
<p>Wrapping of semiconductor pastilles comprises: - (a) production of a semiconductor pastille (5) with a first membrane zone (55); - (b) installation of a cover (10) above the membrane zone leaving behind the membrane zone; - (c) installation of the semiconductor pastille on a mounting frame (1); - (d) realisation of a moulded casing (20) around the semiconductor pastille and of at least one partial zone of the mounting frame in order to wrap the semiconductor pastille. - An INDEPENDENT CLAIM is also included for a semiconductor pastille produced.</p> |
| 申请公布号 |
FR2865575(B1) |
申请公布日期 |
2008.07.25 |
| 申请号 |
FR20050050168 |
申请日期 |
2005.01.20 |
| 申请人 |
ROBERT BOSCH GMBH |
发明人 |
WEIBLEN KURT;BENZEL HUBERT;PINTER STEFAN;GUENSCHEL ROLAND;HAAG FRIEDER |
| 分类号 |
H01L21/56;H01L23/02;B81B3/00;B81B7/00;B81C1/00;B81C3/00;G01L9/00;G01P1/02;H01L21/50;H01L21/52;H01L21/60 |
主分类号 |
H01L21/56 |
| 代理机构 |
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代理人 |
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| 主权项 |
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