发明名称 SUBSTRATE PROCESSING APPARATUS AND FOCUS RING
摘要 A substrate treating apparatus and a focus ring are provided to sufficiently adhere the focus ring to a heat transfer layer by forming the heat transfer layer through a printing process. A substrate treating apparatus includes a receiving chamber, a mounting frame, and a focus ring(24). The receiving chamber receives a substrate. The mounting frame is disposed in the receiving chamber and the substrate is mounted on the mounting frame. The focus ring is disposed on the mounting frame to enclose a peripheral portion of the mounted substrate. The focus ring has a ring shape. A heat transfer layer(39) is formed on the surface of focus ring contacted with the mounting frame. The printing process is one of a screen print process, a coating process, and a spray print process. The heat transfer layer is formed by an elastic member.
申请公布号 KR20080069132(A) 申请公布日期 2008.07.25
申请号 KR20080006172 申请日期 2008.01.21
申请人 TOKYO ELECTRON LIMITED 发明人 MIYAGAWA MASAAKI;NISHIMURA EIICHI
分类号 H01L21/3065 主分类号 H01L21/3065
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