发明名称
摘要 <p>A method and apparatus for electroprocessing a substrate is provided. In one embodiment, a method for electroprocessing a substrate includes the steps of biasing a first electrode to establish a first electroprocessing zone between the electrode and the substrate, and biasing a second electrode disposed radially outward of substrate with a polarity opposite the bias applied tot he first electrode.</p>
申请公布号 JP2008528308(A) 申请公布日期 2008.07.31
申请号 JP20070553195 申请日期 2006.01.24
申请人 发明人
分类号 B24D99/00;B24B37/04;C25F3/16;H01L21/304 主分类号 B24D99/00
代理机构 代理人
主权项
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