| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit device capable of enhancing mounting density and enhancing functionality. <P>SOLUTION: The hybrid integrated circuit device 30 includes a circuit board 56 and a ceramic board 12 arranged by being superposed on each other. Further, a conductive pattern 60 is formed on an upper surface of the circuit board 56 in opposition to the ceramic board 12. In addition, a circuit element 62 is mounted on the conductive pattern 60, and a conductive pattern 16 is formed on a lower surface of the ceramic board 12 in opposition to the circuit board 56, and a semiconductor element 24 is mounted on the conductive pattern 60. Then, the conductive pattern 60 formed on the ceramic board 12 is formed in more multiple layers than the conductive pattern 60 formed on the circuit board 56. <P>COPYRIGHT: (C)2008,JPO&INPIT |
