| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic apparatus in which highly efficient cooling is realized by improving heat radiation performance, in addition to the need of miniaturization with a simple structure. SOLUTION: The electronic apparatus is configured with a mother board 11, having a substrate connection connector 111 and a vent port formed thereon, is disposed between the front and the rear of an apparatus casing 10; heat sinks 20, 18 are separately provided on both surfaces of a unit substrate 12 attached on the mother board 11, and the heat sink 20 of the unit substrate 12 is housed in a duct member 21; a passage is formed with which air is taken from one end of the duct member 21, positioned on the front of the apparatus casing 10 and the air is forcibly guided to the vent port of the mother board 11 via the heat sink 20 and the air is discharged; and a passage is formed, with which air is taken from the outside from an inlet port of the lower part of the duct member 21 on the front of the apparatus casing 10, and the air is discharged from an exhaust port of the upper part of the duct member 21 of the front of the casing apparatus 10 through the heat sink 18. COPYRIGHT: (C)2008,JPO&INPIT
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