| 摘要 |
PROBLEM TO BE SOLVED: To enhance the radiation performance from a heat radiation plate to a cooler with a simple structure. SOLUTION: A case 20 has a plurality of projections 22-1 on an opposite face 20-1 to the mounting face 18-1 of a heat radiation plate 18. Each of the projections 22-1 is adjusted for its height so that, as its position of pressing the mounting face 18-1 of the heat radiation plate 18 is closer to a center of the entire heat sink plate 18, the projection 22-1 is higher. When the heat radiation plate 18 is fixed to the case 20, the mounting face 18-1 of the heat radiation plate 18 is pressed outside, thereby, the projection 22-1 deforms the entire heat radiation plate 18 convexly outside the case 20 in a state that the heat radiation plate 18 is fixed to the case 20. In this state, the semiconductor package 12 is fastened by a bolt in the entire peripheral part of a cooler 14 and the heat radiation plate 18. COPYRIGHT: (C)2005,JPO&NCIPI |
